| 1. | Resistance to soldering temperature for through - hole mounted devices
通孔固定装置的焊接温度抗性 |
| 2. | Semiconductor devices - mechanical and climatic test methods - resistance to soldering temperature for through - hole mounted devices
半导体器件.机械和气候试验方法.通孔安装设备的耐钎焊温度 |
| 3. | Semiconductor devices - mechanical and climatic test methods - part 15 : resistance to soldering temperature for through - hole mounted devices
半导体器件.机械和气候试验方法.第15部分:通孔安装设备的耐钎焊温度 |
| 4. | Semiconductor devices - mechanical and climatic test methods - part 15 : resistance to soldering temperature for through - hole mounted devices
半导体装置.机械和气候试验方法.第15部分:通孔安装装置的耐钎焊温度性能 |
| 5. | When soldering the electrolytic capacitor , the soldering time should never be permitted over 10 seconds , and for 260 ? c of the soldering temperature
在焊接电解电容器时，其焊接时间和焊接温度不应超过10秒钟及260摄氏度。 |
| 6. | Semiconductor devices - mechanical and climatic test methods - part 15 : resistance to soldering temperature for through - hole mounted devices iec 60749 - 15 : 2003 ; german version en 60749 - 15 : 2003
半导体器件.机械和气候试验方法.第15部分:通孔安装设 |
